These chips show a few encouraging early improvements. A standard DIMM (dual integrated memory module, or ‘stick’) of system memory contains between eight and 16 ICs, giving it eight or 16 GB (giga byes) of total capacity. Built on a 10 nm process node, SK Hynix chips have 16 Gb (giga bit) density per integrated circuit (IC). Taiwanese chip maker SK Hynix announced its first DDR5 prototype in November 2018. SK Hynix and Samsung Modules Set to Ship in 2019 Semiconductor manufacturers have already started building DDR5 RAM even though the standard is not yet complete. JEDEC, the trade organization that standardizes system memory and solid-state storage, is still working toward completing the DDR5 specification. The theoretical concept behind DDR5 RAM started taking shape in spring 2017.
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